Application opportunitiesThe Fraunhofer Institute for Silicate Research ISC

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Directly structurable smart materials can enhance the functionality of microelectronic components and form the basis for the design of system-on-a-chip and system-in-a-package solutions, in which the aim is to integrate many different electronic functional elements in a minimum of space. As well as developing piezoelectric materials that can be processed to function as resist layers, Fraunhofer ISC also designs structuring techniques specifically adapted to the requirements of MEMS and MOEMS fabrication.